ST Engineering Spacecraft On-Board Computer (OBC)
Radiation-tolerant dual-core LEON3-FT on-board computer for reliable LEO satellite data handling and platform control.
Typed specifications57 values
Discloses 10 of 13 fields engineers filter by in this category (category median 5).
- Processor
- Dual-Core LEON3-FT Sparc V8 Processor datasheet p.2
- Mass
- 950 g datasheet p.3
- CPU clock
- 40 MHz datasheet p.3 40 MHz System Clock | 80 MHz max | 80 MHz max · up to 80 MHz
- Envelope (L×W×H)
- 215 x 175 x 30 mm3 datasheet p.3 215 x 175 x 30 mm Volume
- RAM
- 32 MB datasheet p.3 32 MB Operational Memory, SRAM
- Mass storage
- 0.008 GB datasheet p.3
- Operating system
- RTEMS Real Time Operating System (RTOS) datasheet p.2 RTEMS RTEMS Real Time Operating System (RTOS)
- Supply voltage
- 16 V min · datasheet p.3 40 V max | 16–40 V Input Voltage 16 V to 40 V
- Power consumption
- 4.8 W Nominal · datasheet p.3 4.8 W nom. · Nominal Power Consumption
- Data interface
- CAN datasheet p.2 CAN 2x CAN 2.0 | LVDS 2x LVDS TC/TM, CCSDS compliant | MIL-STD-1553 2x MIL-STD-1553B, dual bus with Bus Controller capability | SpaceWire 4x SpW +12
- Operating temperature
- -30 °C min · datasheet p.3 70 °C max | -30–70 °C - 30 °C to +70 °C
- Radiation tolerance (TID)
- 20 krad min · datasheet p.3 20 krad min · TID: > 20 kRAD
- Design lifetime
- 5 years min · datasheet p.3 5 years min · Expected Lifespan > 5 years in LEO
- Processor architecture
- LEON / SPARC LEON3-FT Sparc V8 · datasheet p.2
- Radiation and fault mitigation
- other On-board Fault Detection, Isolation and Recovery (FDIR) · datasheet p.1 other tolerant to Single Event Effects (SEE) in operation and stora…
- Cores
- 2 Dual-Core LEON3-FT · datasheet p.2
- FPGA
- Companion FPGA module for AES-256 encryption of TTC link datasheet p.1
- RAM type
- MRAM Non-Volatile Memory 8 MB MRAM · datasheet p.2 SRAM Operational Memory 32 MB SRAM
- Program / boot memory
- 2 MB Boot Memory · datasheet p.2 8 MB Non-Volatile Memory, MRAM
- SEL threshold LET
- 43 MeV·cm²/mg min · SEE: > 43 MeV·cm2/mg · datasheet p.2
- Redundancy
- other available in dual redundant hot/warm configuration · datasheet p.1
- Data interface speed
- 1 Mbps CAN 2.0 · datasheet p.2 40 Mbps SpaceWire, 4x SpW | 0.25 Mbps TC/TM, 2x LVDS | 0.115 Mbps UART, 6x RS422
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier23 lines, in the manufacturer's own wording
- Processor
- Dual-Core LEON3-FT Sparc V8
- System clock
- 40 MHz (up to 80 MHz)
- Fpu
- IEEE-754 compliant, double precision
- Boot memory
- 2 MB
- Non-volatile memory
- 8 MB MRAM
- Operational memory
- 32 MB SRAM
- Operating temperature
- -30°C to +70°C
- Timing synchronization
- 500 us with PPS
- Radiation TID
- > 20 kRAD
- Radiation SEE
- > 43 MeV·cm2/mg
- Expected lifespan
- > 5 years in LEO
- EMC compliance
- MIL-STD-461
- CAN
- 2x CAN 2.0, 1 Mbps
- Spacewire
- 4x SpW, 40 Mbps
- Mil-std-1553
- 2x MIL-STD-1553B, dual bus with Bus Controller capability
- UART
- 6x RS422, 115.2 Kbps
- Tc/tm
- 2x LVDS, 250 Kbps, CCSDS compliant
- Pps
- 2x RS422/LVDS
- Development & debugging
- JTAG & Ethernet
- Volume
- 215 x 175 x 30 mm3
- Mass
- 0.95 Kg
- Supply voltage
- 16 V to 40 V
- Nominal power consumption
- 4.8 W
About
Based on a dual-core LEON3-FT, the On-Board Computer (OBC) provides exceptional processing power and data communication via multiple data buses. Designed to provide reliable data handling and platform control for advanced LEO satellites, the OBC is a radiation-tolerant design with high availability achieved through on-board Fault Detection, Isolation and Recovery (FDIR). It is built around the GR712RC with a Dual-Core LEON3-FT Sparc V8 processor running up to 80 MHz, runs the RTEMS Real Time Operating System (RTOS), and supports on-board data buses including CAN, SpaceWire, MIL-STD-1553B, RS422 UART and PPS. The unit is tolerant to Single Event Effects (SEE) in both operation and storage, is available in a dual redundant hot/warm configuration, and can be paired with a companion FPGA module for AES-256 encryption of the TTC link.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.