HARDWARE / PRODUCTAdded 9 Jul 2026

ST Engineering Spacecraft On-Board Computer (OBC)

ST Engineering Satellite Systems
ST Engineering Spacecraft On-Board Computer (OBC)

Radiation-tolerant dual-core LEON3-FT on-board computer for reliable LEO satellite data handling and platform control.

Typed specifications57 values

Discloses 10 of 13 fields engineers filter by in this category (category median 5).

Processor
Dual-Core LEON3-FT Sparc V8 Processor
datasheet p.2
Mass
950 g
datasheet p.3
CPU clock
40 MHz
datasheet p.3 40 MHz System Clock  |  80 MHz max  |  80 MHz max · up to 80 MHz
Envelope (L×W×H)
215 x 175 x 30 mm3
datasheet p.3 215 x 175 x 30 mm Volume
RAM
32 MB
datasheet p.3 32 MB Operational Memory, SRAM
Mass storage
0.008 GB
datasheet p.3
Operating system
RTEMS Real Time Operating System (RTOS)
datasheet p.2 RTEMS RTEMS Real Time Operating System (RTOS)
Supply voltage
16 V
min · datasheet p.3 40 V max  |  16–40 V Input Voltage 16 V to 40 V
Power consumption
4.8 W
Nominal · datasheet p.3 4.8 W nom. · Nominal Power Consumption
Data interface
CAN
datasheet p.2 CAN 2x CAN 2.0  |  LVDS 2x LVDS TC/TM, CCSDS compliant  |  MIL-STD-1553 2x MIL-STD-1553B, dual bus with Bus Controller capability  |  SpaceWire 4x SpW  +12
Operating temperature
-30 °C
min · datasheet p.3 70 °C max  |  -30–70 °C - 30 °C to +70 °C
Radiation tolerance (TID)
20 krad
min · datasheet p.3 20 krad min · TID: > 20 kRAD
Design lifetime
5 years
min · datasheet p.3 5 years min · Expected Lifespan > 5 years in LEO
Processor architecture
LEON / SPARC
LEON3-FT Sparc V8 · datasheet p.2
Radiation and fault mitigation
other
On-board Fault Detection, Isolation and Recovery (FDIR) · datasheet p.1 other tolerant to Single Event Effects (SEE) in operation and stora…
Cores
2
Dual-Core LEON3-FT · datasheet p.2
FPGA
Companion FPGA module for AES-256 encryption of TTC link
datasheet p.1
RAM type
MRAM
Non-Volatile Memory 8 MB MRAM · datasheet p.2 SRAM Operational Memory 32 MB SRAM
Program / boot memory
2 MB
Boot Memory · datasheet p.2 8 MB Non-Volatile Memory, MRAM
SEL threshold LET
43 MeV·cm²/mg
min · SEE: > 43 MeV·cm2/mg · datasheet p.2
Redundancy
other
available in dual redundant hot/warm configuration · datasheet p.1
Data interface speed
1 Mbps
CAN 2.0 · datasheet p.2 40 Mbps SpaceWire, 4x SpW  |  0.25 Mbps TC/TM, 2x LVDS  |  0.115 Mbps UART, 6x RS422

Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.

As published by the supplier23 lines, in the manufacturer's own wording
Processor
Dual-Core LEON3-FT Sparc V8
System clock
40 MHz (up to 80 MHz)
Fpu
IEEE-754 compliant, double precision
Boot memory
2 MB
Non-volatile memory
8 MB MRAM
Operational memory
32 MB SRAM
Operating temperature
-30°C to +70°C
Timing synchronization
500 us with PPS
Radiation TID
> 20 kRAD
Radiation SEE
> 43 MeV·cm2/mg
Expected lifespan
> 5 years in LEO
EMC compliance
MIL-STD-461
CAN
2x CAN 2.0, 1 Mbps
Spacewire
4x SpW, 40 Mbps
Mil-std-1553
2x MIL-STD-1553B, dual bus with Bus Controller capability
UART
6x RS422, 115.2 Kbps
Tc/tm
2x LVDS, 250 Kbps, CCSDS compliant
Pps
2x RS422/LVDS
Development & debugging
JTAG & Ethernet
Volume
215 x 175 x 30 mm3
Mass
0.95 Kg
Supply voltage
16 V to 40 V
Nominal power consumption
4.8 W

About

Based on a dual-core LEON3-FT, the On-Board Computer (OBC) provides exceptional processing power and data communication via multiple data buses. Designed to provide reliable data handling and platform control for advanced LEO satellites, the OBC is a radiation-tolerant design with high availability achieved through on-board Fault Detection, Isolation and Recovery (FDIR). It is built around the GR712RC with a Dual-Core LEON3-FT Sparc V8 processor running up to 80 MHz, runs the RTEMS Real Time Operating System (RTOS), and supports on-board data buses including CAN, SpaceWire, MIL-STD-1553B, RS422 UART and PPS. The unit is tolerant to Single Event Effects (SEE) in both operation and storage, is available in a dual redundant hot/warm configuration, and can be paired with a companion FPGA module for AES-256 encryption of the TTC link.

Documentation

Need the full ICD, test reports or a specific revision? Ask the supplier directly.

Source: www.stengg.com ↗

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