LiquidCool Solutions

LiquidCool Solutions, Inc. is a Rochester, Minnesota-based engineering company that designs and manufactures total liquid immersion cooling systems for servers and electronic equipment. Founded in 2006, the company originally developed immersion cooling for high-performance gaming PCs before pivoting in 2012 to focus on enterprise server, data center, and industrial computing applications. Its leadership and engineering team include veterans from Dell, IBM, HP, Cray, Silicon Graphics, and Western Digital, and the company holds numerous issued and pending patents around its cooling architecture.

LiquidCool's core innovation is Total Liquid Immersion with Directed Flow (TIDF) technology: sealed, liquid-tight chassis are filled with a dielectric coolant, actively pumped so the coolest fluid reaches the hottest components first, rather than relying on passive convection as in typical tank immersion systems. The approach delivers roughly 1,000-1,400x the cooling capacity of air, reduces cooling-related power usage, requires no fans, air conditioning, or external water, and fits in less than half the space of tank-based immersion systems — all while working with off-the-shelf server components in standard 19-inch rack form factors.

Because the sealed, fanless, liquid-cooled design isolates electronics from dust, humidity, vibration, altitude, and corrosive or contaminated environments, LiquidCool's products are marketed for edge computing and harsh-environment deployments, including industrial IIoT and mobile/rugged field applications. Trade coverage has profiled LiquidCool's directed-flow technology as a candidate cooling solution for military and field-deployed computing systems.