Altom10 Series — LHP Evaporator Modules for Microelectronics
Modular Loop Heat Pipe evaporator modules for microelectronics thermal management — up to 10 m separation, several thousand times the thermal conductivity of copper.
Technical specifications
- Materials
- Copper (Cu) and Stainless Steel (SS)
- Charge chamber volume
- 1–7 cc
- Footprint range
- 28×50 mm to 100×50 mm
- Max condenser separation
- Up to 10 m
- Effective thermal conductivity
- Up to thousands times solid copper
- Moving parts
- None
- Applications
- Space missions, microelectronics cooling
About
The Altom10 Series are compact, modular evaporator units for Loop Heat Pipe (LHP) systems targeting microelectronics cooling in space and high-reliability applications. Available in copper (Cu) and stainless steel (SS) variants, they are configurable across multiple charge chamber volumes (1–7 cc) and footprint sizes from 28×50 mm up to 100×50 mm. The modular approach allows assembly of multi-evaporator LHP arrays with the condenser located up to 10 meters away. Allatherm’s LHP technology achieves effective thermal conductivity up to several thousand times greater than a solid copper rod of equivalent size, with no moving parts for maximum reliability. These modules have been proven in space and planetary missions.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.