iX20
The iX20 transforms up to 100 Gbps of raw sensor data into actionable information through a real-time processing pipeline that combines hardware acceleration, image formation, and onboard AI.
Typed specifications45 values
Discloses 8 of 13 fields engineers filter by in this category (category median 5).
- Processor
- AMD Ryzen 8000-series datasheet p.2
- Mass
- 1 820 g datasheet p.2 1 820 g 1,820 g +/- 15%
- CPU clock
- 2 700 MHz GPU AMD Radeon · datasheet p.2
- Envelope (L×W×H)
- 177 x 177 x 45 mm datasheet p.2
- RAM
- 65 536 MB DDR5 ECC (CPU/GPU) · datasheet p.2
- Mass storage
- 4 096 GB datasheet p.2 4 096 GB 4 x NVMe SSD
- Supply voltage
- 9 V min · datasheet p.2 32 V max | 9–32 V
- Power consumption
- 40 W typical · datasheet p.2 7 W idle | 40–50 W typical | 50 W typical
- Data interface
- LVDS datasheet p.2 Ethernet 2 x 10 GbE (10GBASE-T) | CAN 2 x 2.0A, 2.0B and CAN FD | USB 2 x USB 2.0; expansion module 2 x USB 3.2 | GPIO 24 x +15
- Operating temperature
- -20–55 °C datasheet p.2
- Processor architecture
- GPU / NPU GPU: AMD Radeon, 12-core, 2.7 GHz; VPU: 4 x Hailo-8 · datasheet p.2
- Radiation and fault mitigation
- EDAC / ECC on RAM 64 GB DDR5 ECC · datasheet p.2
- Cores
- 12 GPU AMD Radeon · datasheet p.2
- GPIO lines
- 24 datasheet p.2
- RAM type
- other DDR5 ECC · datasheet p.2
- Data interface speed
- 32 000 Mbps Ingest-to-Inference · datasheet p.2 100 000 Mbps max · Ingest-to-Storage 70-100 Gbps
- Analog inputs
- 15 ADC inputs for, e.g., thermistors · datasheet p.2
- ram_gb
- 64 datasheet p.2
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier12 lines, in the manufacturer's own wording
- CPU
- AMD Ryzen V8000
- GPU
- AMD Radeon, 12-core, 2.7 GHz
- VPU
- 4 x Hailo-8
- RAM
- 64 GB DDR5 ECC (CPU/GPU)
- Storage
- 4 x 4 TB NVMe SSD
- Dimensions
- 177×177×45 [mm]
- Mass
- 1820 g +/- 15%
- Enclosure
- Aluminium ~5 mm
- Power
- 9-32 V
- Power consumption
- 7 W idle, 40-50 W typical
- Operating temperature
- -20 °C to 55 °C
- Target orbit
- LEO, MEO, GEO, Interplanetary
About
The iX20 is designed for high-throughput intelligence, transforming raw sensor data into actionable information using a real-time processing pipeline. This pipeline integrates hardware acceleration, image formation, and onboard AI to handle up to 100 Gbps of data. It features a standardized Expansion Module architecture, allowing for rapid adaptation to new spacecraft, payloads, and mission requirements without needing to redesign the core platform. Security is a core aspect of its design, powered by Unibap SEQR, which protects mission systems and data through encryption, signing, tamper detection, and secure recovery mechanisms, all aligned with the “CIA” security model.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.