HiK Plates / Heat Pipe Assemblies
ACT (Advanced Cooling Technologies)
Custom heat spreaders with embedded copper-water heat pipes offering effective thermal conductivities of 10,000–100,000 W/m·K, designed to collect and move heat from multiple component hotspots to card edges or remote heat sinks.
Typed specifications16 values
Discloses 3 of 7 fields engineers filter by in this category (category median 2).
- Envelope (L×W×H)
- alumina product page 29-39 W/m∙K | 10-100 kV/mm
- Power consumption
- 64 W product page 6 W
- Operating temperature
- 20–150 °C product page
- Product type
- heat pipe embedded Copper/Water heat pipes · datasheet p.1 thermal doubler or spreader heat spreaders made by embedding heat pipes into a structural…
- Material
- Aluminum Plates datasheet p.1 Copper/Water Heat Pipes
- Thickness
- 1.8–6 mm datasheet p.1
- Working fluid
- water Copper/Water Heat Pipes · datasheet p.1
- Survival temperature
- 85 °C max · freeze-thaw tolerant; printed «55°C to +85°C survival», lower… · datasheet p.1
- Flight heritage
- ACT’s Copper-Water Heat Pipes and HiK Plates Now Have Space Fight Heritage datasheet p.2
- Max available size (L × W)
- 60 cm x 60 cm datasheet p.1
- Envelope material
- copper Copper/Water Heat Pipes · datasheet p.1
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier16 lines, in the manufacturer's own wording
- Operating temperature range
- 20–150°C
- Effective thermal conductivity
- 10,000–100,000 W/m·K
- Outer diameter range
- 1/16" (1.5 mm) to 1.5" (38 mm)
- Cross-section geometry
- Round, rectangular, or flattened
- Surface coating options
- Nickel or tin
- Freeze-thaw tolerance
- Yes
- Envelope material
- alumina
- Envelope material thermal conductivity
- 29-39 W/m∙K
- Envelope material breakdown strength
- 10-100 kV/mm
- Working fluid
- R-1233zd
- Fill ratio
- 25%
- Power transport (at 80°C)
- 64 W
- Number of channels
- 20
- Channel diameter
- 0.078’’ (2 mm)
- Voltage isolation
- 28 kV
- Maximum power transport
- 6 W/in2
About
HiK (High Conductivity) Plates are custom-engineered heat spreaders with embedded heat pipe arrays that transport thermal energy from discrete component hotspots to remote heat sinks with minimal temperature gradients. By embedding heat pipes within a metallic plate, ACT creates a planar thermal conduit with effective conductivities far exceeding copper alone.
Copper/water heat pipes embedded in HiK plates operate between 20°C and 150°C with effective thermal conductivities of 10,000 to 100,000 W/m·K. Available outer diameters range from 1/16 inch (1.5 mm) to 1.5 inches (38 mm), with round, rectangular, or flattened cross-sections. HiK plates are particularly effective for conduction-cooled embedded computing cards (VME, VPX, cPCI formats) and Space VPX applications.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.