HiK Plates / Heat Pipe Assemblies
ACT (Advanced Cooling Technologies)
Custom heat spreaders with embedded copper-water heat pipes offering effective thermal conductivities of 10,000–100,000 W/m·K, designed to collect and move heat from multiple component hotspots to card edges or remote heat sinks.
Technical specifications
- Operating temperature range
- 20–150°C
- Effective thermal conductivity
- 10,000–100,000 W/m·K
- Outer diameter range
- 1/16" (1.5 mm) to 1.5" (38 mm)
- Cross-section geometry
- Round, rectangular, or flattened
- Surface coating options
- Nickel or tin
- Freeze-thaw tolerance
- Yes
- Envelope material
- alumina
- Envelope material thermal conductivity
- 29-39 W/m∙K
- Envelope material breakdown strength
- 10-100 kV/mm
- Working fluid
- R-1233zd
- Fill ratio
- 25%
- Power transport (at 80°C)
- 64 W
- Number of channels
- 20
- Channel diameter
- 0.078’’ (2 mm)
- Voltage isolation
- 28 kV
- Maximum power transport
- 6 W/in2
About
HiK (High Conductivity) Plates are custom-engineered heat spreaders with embedded heat pipe arrays that transport thermal energy from discrete component hotspots to remote heat sinks with minimal temperature gradients. By embedding heat pipes within a metallic plate, ACT creates a planar thermal conduit with effective conductivities far exceeding copper alone.
Copper/water heat pipes embedded in HiK plates operate between 20°C and 150°C with effective thermal conductivities of 10,000 to 100,000 W/m·K. Available outer diameters range from 1/16 inch (1.5 mm) to 1.5 inches (38 mm), with round, rectangular, or flattened cross-sections. HiK plates are particularly effective for conduction-cooled embedded computing cards (VME, VPX, cPCI formats) and Space VPX applications.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.