GM1001-F GEESATCOM Satellite Communication Module
Geespace
High-integration stamp-hole satellite communication module for GEESATCOM.
Technical specifications
- Supported network
- GEESATCOM satellite communications
- Integration
- Satellite communication chipset, power amplifier, low-noise amplifier
- Operating temperature
- -40C to +85C
- Power consumption
- Average 300mW, peak <=10W
- Dimensions
- 30mm x 35mm x 3.5mm, LCC package
About
This module is a dedicated satellite communication module for GEESATCOM. It integrates the GEESATCOM satellite communication chip, power amplifier, low-noise amplifier, and other functional units. Utilizing a stamp-hole packaging method compatible with mainstream satellite communication modules, it offers high integration, low power consumption, and a built-in power management circuit. Only minimal external circuitry is required to quickly enable satellite communication functionality, making it convenient for rapid integration and design of satellite communication products for automotive electronics and industrial applications.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.
