GSP2022 GEESATCOM Satellite Communication Chip
Geespace
The GEESATCOM GSP2022 satellite communication chip leverages an industry-leading 22nm manufacturing process, specifically designed for satellite communication and navigation. It incorporates an integrated RF and baseband System-on-Chip (SoC) design, which contributes to its high sensitivity, low power consumption, and simplified peripheral circuit requirements. The chip is equipped with an ARM Cortex-A7 processor and features a […]
Key figurescomparable across the catalogue
- Power
- 0.12 W
- Largest dimension
- 4 mm
Normalised to common units so this product can be compared with others in its category. The supplier's own wording is below.
As published by the supplier
- Process technology
- 22 nm
- Processor
- ARM Cortex-A7
- Design
- RF and baseband integrated SoC
- RF architecture
- High-linearity, anti-interference
- Dimensions
- 4 mm x 4 mm
- Package
- WLCSP
- Power consumption
- 120 mW
About
The GEESATCOM GSP2022 satellite communication chip leverages an industry-leading 22nm manufacturing process, specifically designed for satellite communication and navigation. It incorporates an integrated RF and baseband System-on-Chip (SoC) design, which contributes to its high sensitivity, low power consumption, and simplified peripheral circuit requirements. The chip is equipped with an ARM Cortex-A7 processor and features a high-linearity, anti-interference RF architecture. Packaged in a WLCSP with a compact size of 4mm x 4mm, it is designed for broad applicability across various sectors. Its features make it suitable for integration into mobile devices, automotive electronics, and a range of industrial applications, enabling satellite communication capabilities in these diverse scenarios.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.