GSP2022 GEESATCOM Satellite Communication Chip
22nm SoC satellite communication and navigation chip with integrated RF and baseband.
Technical specifications
- Manufacturing process
- 22nm
- Processor
- Integrated ARM Cortex-A7
- Design
- RF and baseband integrated
- RF architecture
- High-linearity, anti-interference
- Size
- 4mm x 4mm, WLCSP package
- Power consumption
- 120mW
About
The GEESATCOM satellite communication chip (GSP2022) utilizes the industry-leading 22nm manufacturing process for satellite communication and navigation. With an integrated RF and baseband SoC design, this chipset offers high sensitivity, low power consumption and simplified peripheral circuits. It is designed for wide applicability in mobile devices, automotive, and various industrial applications, enabling compact satellite-connectivity integration for smartphones, automotive electronics and industrial equipment.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.