HARDWARE / PRODUCTAdded 2 Jul 2026

OHP Heat Frames

Thermavant
OHP Heat Frames

Oscillating heat pipe (OHP) embedded structural heat frames for VPX/VITA circuit cards and RF/power electronics, offering up to 3x-5x the thermal conductance of solid aluminum with no added mass or moving parts.

Typed specifications4 values

Discloses 1 of 7 fields engineers filter by in this category (category median 2).

Mass
600 g
product page
Operating temperature
-55 °C
product page -55 °C
Flight heritage
Over 1,000 fielded OHP units for ground application; qualified through MIL-STD thermal cycling, vibration, shock, pressure cycling; TRL 9
product page

Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.

As published by the supplier21 lines, in the manufacturer's own wording
3u example thermal performance (OHP)
10 °C rise per 130 W
3u example thermal performance (solid Al)
30 °C rise per 130 W (3x worse than OHP)
3u example thermal performance (solid Cu)
14 °C rise per 130 W (1.4x worse than OHP)
3u example mass
135 g (Al 6061 T4 w/ ChemFilm)
3u shape & structure
Standard VITA 3U (~3.9" x 5.9"), min. thickness 0.06", equipped with COTS wedgelocks
3u temperature range
-55 °C to +95 °C
6u example thermal performance (OHP)
5 °C rise per 110 W
6u example thermal performance (solid Al)
25 °C rise per 110 W (5x worse than OHP)
6u example mass
600 g
6u shape & structure
Standard VITA 48.2 6U VPX (~9" x 6"), min. thickness 0.13", equipped with COTS wedgelocks
6u temperature range
-55 °C to +85 °C
Materials
Al and Al composites (0 to T6 temper, most common); Cu and Cu composites incl. Copper-Molybdenum; Ni alloys incl. Invar and Kovar; ceramics (device-level spreaders)
Working fluids
Water, ketones, alkanes, alcohols, hydrochlorofluorocarbons, perfluorocarbons, hydrofluorocarbons; cryogenic (below 100 K) to liquid metal (above 1,000 °C) options
Heat flux range
< 1 W/cm² to > 300 W/cm²
Heat load per ohp
1 W to > 10,000 W
Ohp length range
2 cm to 2 m
Gravity independence
0.3 m OHPs tested at 9 g adverse gravity; 1.2 m OHP tested at 1 g adverse gravity
Thickness range
< 1 mm to 2 m in length; widths < 2 cm to > 1 m
Coatings
Chemical conversion coating and anodization; platings and dielectric coatings
Flight heritage
Over 1,000 fielded OHP units for ground application; qualified through MIL-STD thermal cycling, vibration, shock, pressure cycling; TRL 9
Lead time
4 weeks for recurring hardware; 4-6 months for custom new builds

About

Heat frames are structural and thermal management components used to conduct heat away from circuit cards, processors, RF devices, power electronics, and other heat-generating elements. ThermAvant Technologies’ OHP-embedded heat frames are especially valuable when compact packaging and reliability are essential, relying on the ultra-high thermal conductivity of oscillating heat pipes (OHPs) to achieve this. ThermAvant develops and delivers OHP-embedded heat frames in a variety of form factors compatible with VPX, VITA, and next-generation embedded platforms for aerospace, defense, industrial systems, and transportation applications.

Each OHP is embedded directly into the frame structure, functioning as a single monolithic structural part while passively moving heat with zero moving parts, pumps, or fans. Baseline templates are offered for common VPX/VITA module sizes (3U, 6U), and all frames can be customized to specific power and layout requirements, including through-holes, threaded features, and complex 3D internal channel routing. Typical lead times run 4 weeks for recurring hardware and 4-6 months for new custom designs, with over 1,000 fielded OHP heat frame units across airborne and ground applications, qualified through MIL-STD thermal cycling, vibration, shock, and pressure cycling.

Documentation

No public datasheet yet — request the datasheet / ICD from the supplier.

Source: www.thermavant.com ↗

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