OHP Heat Frames
Thermavant
Oscillating heat pipe (OHP) embedded structural heat frames for VPX/VITA circuit cards and RF/power electronics, offering up to 3x-5x the thermal conductance of solid aluminum with no added mass or moving parts.
Key figurescomparable across the catalogue
- Mass
- 135,000 kg
- Lead time
- 0.921 months
Normalised to common units so this product can be compared with others in its category. The supplier's own wording is below.
As published by the supplier
- 3u example thermal performance (OHP)
- 10 °C rise per 130 W
- 3u example thermal performance (solid Al)
- 30 °C rise per 130 W (3x worse than OHP)
- 3u example thermal performance (solid Cu)
- 14 °C rise per 130 W (1.4x worse than OHP)
- 3u example mass
- 135 g (Al 6061 T4 w/ ChemFilm)
- 3u shape & structure
- Standard VITA 3U (~3.9" x 5.9"), min. thickness 0.06", equipped with COTS wedgelocks
- 3u temperature range
- -55 °C to +95 °C
- 6u example thermal performance (OHP)
- 5 °C rise per 110 W
- 6u example thermal performance (solid Al)
- 25 °C rise per 110 W (5x worse than OHP)
- 6u example mass
- 600 g
- 6u shape & structure
- Standard VITA 48.2 6U VPX (~9" x 6"), min. thickness 0.13", equipped with COTS wedgelocks
- 6u temperature range
- -55 °C to +85 °C
- Materials
- Al and Al composites (0 to T6 temper, most common); Cu and Cu composites incl. Copper-Molybdenum; Ni alloys incl. Invar and Kovar; ceramics (device-level spreaders)
- Working fluids
- Water, ketones, alkanes, alcohols, hydrochlorofluorocarbons, perfluorocarbons, hydrofluorocarbons; cryogenic (below 100 K) to liquid metal (above 1,000 °C) options
- Heat flux range
- < 1 W/cm² to > 300 W/cm²
- Heat load per ohp
- 1 W to > 10,000 W
- Ohp length range
- 2 cm to 2 m
- Gravity independence
- 0.3 m OHPs tested at 9 g adverse gravity; 1.2 m OHP tested at 1 g adverse gravity
- Thickness range
- < 1 mm to 2 m in length; widths < 2 cm to > 1 m
- Coatings
- Chemical conversion coating and anodization; platings and dielectric coatings
- Flight heritage
- Over 1,000 fielded OHP units for ground application; qualified through MIL-STD thermal cycling, vibration, shock, pressure cycling; TRL 9
- Lead time
- 4 weeks for recurring hardware; 4-6 months for custom new builds
About
Heat frames are structural and thermal management components used to conduct heat away from circuit cards, processors, RF devices, power electronics, and other heat-generating elements. ThermAvant Technologies’ OHP-embedded heat frames are especially valuable when compact packaging and reliability are essential, relying on the ultra-high thermal conductivity of oscillating heat pipes (OHPs) to achieve this. ThermAvant develops and delivers OHP-embedded heat frames in a variety of form factors compatible with VPX, VITA, and next-generation embedded platforms for aerospace, defense, industrial systems, and transportation applications.
Each OHP is embedded directly into the frame structure, functioning as a single monolithic structural part while passively moving heat with zero moving parts, pumps, or fans. Baseline templates are offered for common VPX/VITA module sizes (3U, 6U), and all frames can be customized to specific power and layout requirements, including through-holes, threaded features, and complex 3D internal channel routing. Typical lead times run 4 weeks for recurring hardware and 4-6 months for new custom designs, with over 1,000 fielded OHP heat frame units across airborne and ground applications, qualified through MIL-STD thermal cycling, vibration, shock, and pressure cycling.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.