HARDWARE / PRODUCTUpdated 24 Jul 2026

Kryten-M3 & Kryten-M3 PLUS

AAC Clyde Space
Kryten-M3 & Kryten-M3 PLUS

The Kryten-M3 and Kryten-M3 PLUS are command and data handling solutions designed for price-sensitive commercial missions requiring reliable and qualified solutions.

Typed specifications54 values

Discloses 10 of 13 fields engineers filter by in this category (category median 5).

Processor
Smart Fusion 2 SoC including an ARM Cortex-M3 processor
datasheet p.2
Mass
61.9 g
datasheet p.2
CPU clock
50 MHz
datasheet p.2
Envelope (L×W×H)
95.89 mm x 90.17 mm x 5.51 mm
datasheet p.2 95.89 x 90.17 x 5.51 mm height from top PCB to lowest component
RAM
16 MB
datasheet p.2 16 MB MRAM
Mass storage
4 GB
datasheet p.1 4 GB SLC flash, bulk data storage
Power consumption
0.4 W
Nominal · datasheet p.2 1 W max  |  1 W max  |  0.4 W nom. · typ
Data interface
I2C
datasheet p.2 GPIO 17x, 3.3 V logic  |  RS-422 1x  |  SPI 1x, 7 chip select lines  |  LVDS 20x lines, expansion  +16
Operating temperature
-40 °C
min · datasheet p.2 80 °C max  |  -40–80 °C
Radiation tolerance (TID)
20 krad
datasheet p.2
Design lifetime
5 years
datasheet p.2 5 years in LEO
Processor architecture
ARM Cortex-M
ARM Cortex-M3 · datasheet p.2
Board format
1U board 90x96 mm
datasheet p.2
Radiation and fault mitigation
latch-up protection (current limiting)
autonomous single event latch-up protection · datasheet p.1 EDAC / ECC on RAM EDAC protected memories and FIFOs  |  ECC on flash MRAM and Flash memories are protected via an EDAC mechanism  |  EDAC / ECC on RAM
Flight heritage
Flight proven across multiple mission applications for a range of customer requirements
datasheet p.1
Satellite class
nanosat 1-10 kg
for the most demanding nanosatellite missions · datasheet p.1
FPGA
SmartFusion 2 SoC
datasheet p.2
GPIO lines
17
3.3 V logic · datasheet p.2
Performance
62.5 DMIPS
datasheet p.2
RAM type
MRAM
datasheet p.2
Program / boot memory
0.25 MB
eNVM, boot image storage · datasheet p.2 8 MB MRAM, boot image storage

Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.

As published by the supplier16 lines, in the manufacturer's own wording
Design life
5 years in LEO
Processor
SmartFusion2 SoC ARM Cortex-M3, 62.5 DMIPS
Clock
50 MHz
Mram
16 MB
Radiation (TiD)
20 kRAD
Power
400 mW typ, 1 W max
Operating temperature
-40 to +80 C
I2C
2
SPI
7 Chip Select Lines
UART
8
RS422
1
CAN
1
Gpio
17
Mass
61.9 g
Dimensions
95.89 x 90.17 x 5.51 mm
GPS (PLUS model)
<10m RMS position, <1m/s RMS velocity

About

The Kryten-M3 and Kryten-M3 PLUS are command and data handling (CDH) solutions developed to support price-sensitive commercial missions. These solutions are engineered to provide reliable and qualified performance, making them suitable for various aerospace applications. Their design emphasizes a small size, low mass, and efficient power consumption, which are critical factors for integration into space systems. While the provided text is brief, it highlights the core purpose of these units as essential components for managing commands and data within spacecraft, ensuring operational integrity for commercial ventures in space.

Documentation

Need the full ICD, test reports or a specific revision? Ask the supplier directly.

Source: www.aac-clyde.space ↗

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