SiP – System-in-Package

System-in-package or SiP is a technology where a number of integrated circuits are enclosed in a single module. Dies containing integrated circuits may be stacked vertically on a substrate and are internally connected by fine wires bonded to the package. SiP products are particularly suitable for applications in harsh environments such as Aerospace (Satellite, Spaceship, Launch vehicle, Deep Space Probes), Communications (Radar, TCTM systems), Aviation (Aircraft, Helicopter, Flight data recorder), and Industrial Control (Data Storage, Automation Equipment).

Advantages of SiP parts include high performance, high reliability, and the use of high-performance materials. They offer improved mechanical and electrical properties, adoption of international advanced level packaging technology, reduced length of internal signal connection, reduced parasitics, and enhanced anti-jamming capability. SiP also provides a high level of integration, high capacity, and miniaturization. This includes three-dimensional packaging of memory types (SRAM, SDRAM, FLASH, MRAM etc.) allowing for different memory widths (8bit, 16bit, 32bit, 40bit, and 64bit) and high-capacity memory configurations. Furthermore, complex and large computer circuit boards (e.g. CPU, Memory, A2D, and I/0) can be packaged into highly integrated, miniaturized SiP computer systems for use in Launch Vehicles, Satellites, Aircraft, and Space Shuttles. The integration of high performance, high reliability, and radiation-hardened components results in excellent TID and SEE performance.