Fusio RT Space Computer Core
3D Plus (HEICO)
Rad-hard-by-design SRAM-based FPGA computer core family with 4.4 million system gates, 128 Mbit TMR configuration memory, and optional NAND Flash and SDRAM in a single 32×32 mm BGA package. Available in four variants.
Typed specifications6 values
Discloses 4 of 13 fields engineers filter by in this category (category median 5).
- Envelope (L×W×H)
- 32 × 32 mm² product page
- RAM
- 2 048 MB product page
- Mass storage
- 64 GB product page
- Operating system
- 263 product page
- Operating temperature
- -40 °C product page
- Radiation tolerance (TID)
- 40 krad min · product page
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier11 lines, in the manufacturer's own wording
- FPGA resources
- 550k ASIC gate equivalents (4,400,000 system gates)
- User i/os
- 263
- I/o speed
- Up to 800 Mbps
- Configuration memory
- 128 Mbit TMR NOR Flash
- Nand flash (NAND/FULL)
- 64 Gb
- Sdram (SDRAM/FULL)
- 2 Gb
- Package
- 483 balls BGA, 1.27 mm pitch
- Package size
- 32 × 32 mm²
- Operating temperature
- -40°C to +105°C
- TID tolerance
- >40 krad(Si)
- SEL letth
- >60 MeV.cm²/mg
About
The 3D PLUS Fusio RT family provides a reprogrammable Rad Hard By Design (RHBD) SRAM-based FPGA with high-reliability embedded memories integrated in a single miniaturized package. The core FPGA provides 550k ASIC gate equivalents (4,400,000 system gates), 263 user I/Os supporting up to 800 Mbps, and 128 Mbit TMR NOR Flash configuration memory for reliable reconfiguration without single event upsets.
Four variants address different memory integration needs: Fusio RT BASIC (3DMC0753) with the FPGA and configuration memory only; Fusio RT NAND (3DMC0754) adding 64 Gb NAND Flash mass storage; Fusio RT SDRAM (3DMC0755) adding 2 Gb SDRAM for working memory; and Fusio RT FULL (3DMC0752) integrating all of the above. All are housed in a 483-ball BGA at 1.27 mm pitch, 32×32 mm², for SMT assembly.
Radiation performance includes TID tolerance greater than 40 krad(Si) and SEL LETth greater than 60 MeV.cm²/mg. Operating temperature spans -40°C to +105°C. The modular memory integration approach enables system designers to reduce component count, board space, and harness complexity while achieving high integration levels typical of custom ASIC designs.
The Fusio RT is ideally suited for telecommunications satellites, experimental instruments, and any mission requiring high-performance reconfigurable computing with on-orbit reprogramming capability.
Documentation
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
- Datasheet (PDF) www.3d-plus.com ↗
Need the full ICD, test reports or a specific revision? Ask the supplier directly.