CASPEX 4Mpx Space Camera Head
3D Plus (HEICO)
Space-qualified 4-megapixel CMOS camera head with FPGA-based reconfigurable architecture, global shutter, 2048×2048 resolution, and SpaceWire interface in a 35×35×23 mm package. Available in monochrome (3DCM734) and RGB (3DCM739).
Typed specifications4 values
Discloses 0 of 9 fields engineers filter by in this category (category median 4).
- Mass
- 64 g product page
- Envelope (L×W×H)
- 35 × 35 × 23 mm³ product page
- Operating temperature
- -40 °C product page
- Radiation tolerance (TID)
- 30 krad min · product page
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier14 lines, in the manufacturer's own wording
- Resolution
- 2048 × 2048 pixels (4 Mpx)
- Sensor type
- Global Shutter Visible CMOS
- Maximum frame rate
- Up to 16 frame/s at sensor interface
- Read noise
- 13 e⁻
- Dark current
- 125 e⁻/s at 25°C
- Full well capacity
- 13,500 e⁻
- Operating temperature
- -40°C to +70°C
- TID tolerance
- >30 krad
- SEL letth
- >60 MeV.cm²/mg
- Dimensions
- 35 × 35 × 23 mm³
- Mass
- 64 g
- Package
- BJ3a (55-pin PGA)
- Power supply
- 5 V to 9 V
- Interface
- 12 LVDS pairs, 13 GPIOs, JTAG
About
The 3D PLUS CASPEX 4M Space Camera Head is a high-resolution, high-performance space-grade imaging module designed for demanding space applications. Integrating a 2048×2048 pixel global shutter visible CMOS sensor with a user-reconfigurable FPGA-based electronic architecture, the CASPEX 4M provides configurable embedded image processing, formatting, and interfacing capabilities in a compact 35×35×23 mm³ package weighing only 64 g.
The camera head is available in monochrome (3DCM734) and RGB (3DCM739) variants, with a maximum frame rate of up to 16 frame/s at the sensor interface. Sensor performance includes 13 e⁻ read noise, 125 e⁻/s dark current at 25°C, and 13.5k e⁻ full well capacity. The 55-pin PGA (BJ3a) package interfaces via 12 LVDS pairs, 13 GPIOs, JTAG, and a 5–9V power supply.
Radiation performance includes TID tolerance greater than 30 krad and SEL LETth greater than 60 MeV.cm²/mg. Operating temperature spans -40°C to +70°C. The CASPEX 4M has significant flight heritage, including use on the Mars 2020 Perseverance Rover mission, and forms the imaging sensor for the complete IRIS 4M Space Camera System.
An evaluation board (EGSE) with full development IP cores for SDRAM memory controller, NAND Flash controller, and CMOS image sensor controller is available for rapid mission development.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.