CASPEX 12Mpx Space Camera Head
3D Plus (HEICO)
Space-qualified 12-megapixel CMOS camera head with 4096×3000 resolution, 68 frame/s, global shutter, and FPGA-based processing in a 40×40×39 mm package. Available in short and long thermal drain configurations for mono and RGB.
Typed specifications4 values
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- Mass
- 120 g product page
- Envelope (L×W×H)
- 40 × 40 × 39 mm³ product page
- Operating temperature
- -55 °C product page
- Radiation tolerance (TID)
- 40 krad min · product page
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier13 lines, in the manufacturer's own wording
- Resolution
- 4096 × 3000 pixels (12 Mpx)
- Sensor type
- Global Shutter Visible CMOS
- Maximum frame rate
- 68 frame/s at sensor interface
- Read noise
- 2 e⁻
- Dark current
- 10 e⁻/s at 25°C
- Full well capacity
- 11,000 e⁻
- Operating temperature
- -55°C to +70°C
- TID tolerance
- >40 krad(Si)
- SEL letth
- >60 MeV.cm²/mg
- Dimensions
- 40 × 40 × 39 mm³
- Mass
- 120 g
- Package
- CE4 or CE4b (77-pin PGA)
- Power supply
- 5 V
About
The 3D PLUS CASPEX 12M Space Camera Head is an all-in-one space-qualified high-resolution imaging module integrating a 12-megapixel global shutter visible CMOS sensor with FPGA-based processing architecture in a compact 40×40×39 mm³ package weighing 120 g. The FPGA-based electronic architecture is user-reconfigurable, providing configurable embedded image processing, formatting, and interfacing capabilities.
With 4096×3000 pixel resolution and a maximum frame rate of 68 frame/s at the sensor interface, the CASPEX 12M surpasses the 4M variant for applications requiring finer spatial resolution or higher throughput. Sensor performance includes 2 e⁻ read noise, 10 e⁻/s dark current at 25°C, and 11,000 e⁻ full well capacity. The 77-pin PGA (CE4) interface provides 22 LVDS pairs, JTAG configuration, and 5V supply connectivity.
Four variants address thermal and spectral requirements: 3DCM800 (mono, short thermal drain), 3DCM878 (mono, long thermal drain), 3DCM828 (RGB, short thermal drain), and 3DCM879 (RGB, long thermal drain). Operating temperature spans -55°C to +70°C, with TID tolerance greater than 40 krad(Si) and SEL LETth greater than 60 MeV.cm²/mg.
An evaluation kit and development board with full IP core suite are available for rapid mission development and ground segment testing.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.