HARDWARE / PRODUCTAdded 1 Jul 2026

CASPEX 12Mpx Space Camera Head

3D Plus (HEICO)
CASPEX 12Mpx Space Camera Head

Space-qualified 12-megapixel CMOS camera head with 4096×3000 resolution, 68 frame/s, global shutter, and FPGA-based processing in a 40×40×39 mm package. Available in short and long thermal drain configurations for mono and RGB.

Key figurescomparable across the catalogue

Mass
0.12 kg
Largest dimension
40 mm

Normalised to common units so this product can be compared with others in its category. The supplier's own wording is below.

As published by the supplier

Resolution
4096 × 3000 pixels (12 Mpx)
Sensor type
Global Shutter Visible CMOS
Maximum frame rate
68 frame/s at sensor interface
Read noise
2 e⁻
Dark current
10 e⁻/s at 25°C
Full well capacity
11,000 e⁻
Operating temperature
-55°C to +70°C
TID tolerance
>40 krad(Si)
SEL letth
>60 MeV.cm²/mg
Dimensions
40 × 40 × 39 mm³
Mass
120 g
Package
CE4 or CE4b (77-pin PGA)
Power supply
5 V

About

The 3D PLUS CASPEX 12M Space Camera Head is an all-in-one space-qualified high-resolution imaging module integrating a 12-megapixel global shutter visible CMOS sensor with FPGA-based processing architecture in a compact 40×40×39 mm³ package weighing 120 g. The FPGA-based electronic architecture is user-reconfigurable, providing configurable embedded image processing, formatting, and interfacing capabilities.

With 4096×3000 pixel resolution and a maximum frame rate of 68 frame/s at the sensor interface, the CASPEX 12M surpasses the 4M variant for applications requiring finer spatial resolution or higher throughput. Sensor performance includes 2 e⁻ read noise, 10 e⁻/s dark current at 25°C, and 11,000 e⁻ full well capacity. The 77-pin PGA (CE4) interface provides 22 LVDS pairs, JTAG configuration, and 5V supply connectivity.

Four variants address thermal and spectral requirements: 3DCM800 (mono, short thermal drain), 3DCM878 (mono, long thermal drain), 3DCM828 (RGB, short thermal drain), and 3DCM879 (RGB, long thermal drain). Operating temperature spans -55°C to +70°C, with TID tolerance greater than 40 krad(Si) and SEL LETth greater than 60 MeV.cm²/mg.

An evaluation kit and development board with full IP core suite are available for rapid mission development and ground segment testing.

Documentation

Need the full ICD, test reports or a specific revision? Ask the supplier directly.

Source: www.3d-plus.com ↗

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