PAKPIC
Mbryonics
PAKPIC offers high-precision packaging services for photonic integrated circuits (PICs), including fibre array attachment, mechanical mounting, and flip-chip bonding, tailored for commercial applications.
Technical specifications
- Fibre array attach process - lidded and lidless fibre arrays
- Yes
- Fibre array attach process - channel configurations
- 8, 12, 16 channel (32-channel by request)
- Fibre array attach process - pitch
- 127 µm or 250 µm
- Fibre array attach process - fibre types
- UHNA (3 μm SSCs) or SSMF (6–10 μm SSCs)
- Fibre array attach process - electrical connections
- DC and FR supported
- Mechanical mounting - bonding materials
- Silver epoxy or thermally conductive epoxy bond
- Mechanical mounting - placement method
- Pick and place or manual
- Flip-chip bonding (low volume) - placement accuracy
- <1 µm
- Flip-chip bonding (low volume) - reflow
- Controlled ramp rates
- Mechanical package design and fabrication - foundry-agnostic packaging
- SOI, SiN, and InP systems
- Mechanical package design and fabrication - wire bonding
- High-precision
- Design consultancy - features
- PIC design/layout for packaging, Packaging feasibility study, Bespoke mechanical packages, Design for vacuum, Radiation hardness by design
- Supply-chain support - components
- Fibre arrays, Electronic components (TECs, thermistors, etc.), PCB manufacturing
About
PAKPIC provides high-precision packaging solutions for photonic integrated circuits (PICs), designed to meet the demands of commercial applications and align with Moore’s Law and ‘More than Moore’ principles. The service offers advanced fibre array attachment processes, including both lidded and lidless options with various channel configurations (8, 12, 16 channels standard, 32-channel by request). It supports 127 µm or 250 µm pitch and accommodates UHNA (3 μm SSCs) or SSMF (6–10 μm SSCs) fibre types. Electrical DC and FR connections are also supported. Mechanical package design is meticulously handled to ensure optimal performance across various systems, including SOI, SiN, and InP. Mechanical mounting options include silver epoxy or thermally conductive epoxy bond, with pick and place or manual methods depending on complexity. Low-volume flip-chip bonding is available with sub-1 µm placement accuracy and controlled ramp rate reflow. The service also covers mechanical package design and fabrication, offering foundry-agnostic packaging for SOI, SiN, and InP systems, with standard designs for rapid turnaround and high-precision wire bonding. Design consultancy services include PIC design/layout for packaging (subject to design rules), packaging feasibility studies, bespoke mechanical packages, design for vacuum, and radiation hardness by design. Additionally, PAKPIC provides supply-chain support for fibre arrays, electronic components like TECs and thermistors, and PCB manufacturing for both low and high-speed applications. The service is committed to supporting volume production for both low and high-speed applications, ensuring accuracy, reliability, and scalability.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.