High-precision packaging service for photonic integrated circuits, covering fiber array attachment, flip-chip bonding, wire bonding, and space-grade design consultancy.
PakPIC
High-precision packaging service for photonic integrated circuits, covering fiber array attachment, flip-chip bonding, wire bonding, and space-grade design consultancy.
Description
PakPIC is Mbryonics' high-precision packaging service for photonic integrated circuits (PICs), tailored for commercial and space-qualified applications. Services include fiber array attachment in lidded or lidless configurations (8, 12, 16, or 32-channel options) at 127 micron or 250 micron pitch, supporting UHNA and SSMF fiber types with electrical and FR connections. Mechanical mounting is performed using silver epoxy or thermally conductive epoxy, alongside flip-chip bonding with sub-micron placement accuracy and high-precision wire bonding. PakPIC is foundry-agnostic, supporting SOI, SiN, and InP photonic platforms, and includes design consultancy covering PIC layout optimization, feasibility studies, vacuum design, and radiation-hardness considerations, plus supply-chain support for fiber arrays, electronic components such as TECs and thermistors, and PCB manufacturing.