PakPIC Photonic Packaging Services
Mbryonics
High-precision photonic packaging service — fibre array attachment, flip-chip bonding with sub-micron accuracy, and mechanical package design for SOI, SiN, and InP photonic integrated circuits.
Technical specifications
- Fibre array channel counts
- 8, 12, 16 (32-channel by request)
- Pitch
- 127 µm or 250 µm
- Spot-size converters
- UHNA (3 µm) or SSMF (6-10 µm)
- Flip-chip placement accuracy
- < 1 µm
- Supported material systems
- SOI, SiN, InP
- Design options
- Vacuum-compatible, radiation-hardened by design
About
PakPIC is MBRYONICS’s packaging services line covering fibre array attach processes (lidded and lidless, 8/12/16-channel, 32-channel by request, 127 µm or 250 µm pitch), mechanical mounting, and low-volume flip-chip bonding with less than 1 µm placement accuracy and controlled reflow ramp rates. It offers foundry-agnostic mechanical package design and fabrication for SOI, SiN, and InP photonic systems, including rapid-turnaround designs, high-precision wire bonding, PIC design/layout consultancy, packaging feasibility studies, bespoke mechanical packages, and design for vacuum and radiation hardness — supported by supply-chain services for fibre arrays, electronic components, and PCB manufacturing.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.
