Single-part and Small-scale Production of Interconnection Ceramic Printed Circuit Boards
This product offers single-part and small-scale production of interconnection ceramic printed circuit boards designed for microwave transmitting-receiving radio equipment units.
Technical specifications
- Year of release
- 1980
- Design life
- Depends on product requirements.
- Lead time
- Based on the degree of product complexity.
- Flight qualification of the product
- No
- Possibility to adapt the product to customer requirements
- Yes
- Maximum size of interconnection printed circuit board
- 48 × 60 mm
- Minimum conductor size
- 50 µm
- Minimum conductor to conductor clearance
- 50 µm
About
This product provides single-part and small-scale manufacturing services for interconnection ceramic printed circuit boards. These PCBs are specifically intended for use in transmitting-receiving radio equipment units that operate within the microwave frequency range. The manufacturing process supports various materials, including polycarbonate, sitall, and leucosapphire. Key specifications include a maximum board size of 48×60 mm, a minimum conductor size of 50 µm, and a minimum conductor to conductor clearance of 50 µm. The product was first released in 1980, and its guaranteed service life is dependent on specific product requirements. Production and delivery times are estimated based on the complexity of the product. While the product is adaptable to customer requirements, it does not currently possess flight qualification.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.