HIGH DENSITY INTERCONNECT
Minco Products, Inc
Minco High Density Interconnect (HDI) flex circuits improve electrical performance and consistency by using vias as small as 50 microns or 9-micron copper to increase density in a small electronic package.
Technical specifications
- Microvia formation
- 50 micron
- Registration accuracy
- ±12 micron
- Thru-hole plating aspect ratio
- 12:1
- Blind microvia aspect ratio
- 1:1
- Surface and hole thickness uniformity
- 4% CV
- Finished microvia formation
- 50 micron
- Etched feature inspection
- 45 micron
- Pitch
- 175 micron
- Minimum line and spacing
- 50 micron
- Minimum core dielectric thickness
- 25 micron
- Minimum copper thickness
- 9 micron
About
Running out of real estate with conventional feature sizes? Minco High Density Interconnect (HDI) flex circuits can improve electrical performance and consistency by using vias as small as 50 microns or 9-micron copper to increase density in a small electronic package. These circuits offer integration-ready features, including decreased package size for a smaller overall footprint. Additionally, blind and buried via constructions introduce additional design options, providing greater flexibility for complex electronic assemblies. Minco has designed and manufactured flex circuit solutions for some of the world’s most demanding applications for more than 60 years, including the aerospace industry. Their flex circuits are designed to achieve new design freedom and improve reliability in a condensed package size.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.