Multi-layer Flex
Minco's multi-layer flex technology allows stacking layers in applications where wire bundles would otherwise consume excessive space.
About
Minco’s multi-layer flex technology provides the ability to stack layers in applications where wire bundles might take up too much space. In multi-layer flex solutions, three or more flex layers are used to accommodate more routed signals without increasing footprint size. These solutions can incorporate multiple conductive layers of varying copper thickness, and layer counts are scalable to meet the needs of the application. Flexible features can accommodate EMI shielding layers and through-hole assembly, while unbonded areas can increase circuit flexibility. Minco has designed and manufactured flex circuit solutions for over 60 years, serving demanding applications in industries such as Aerospace, Medical, and Defense and Military.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.