CubeSat Kit for Microchip PIC24 MCUs w/USB OTG
Pumpkin, Inc.
Pumpkin's complete CubeSat bus kit built around the Microchip PIC24FJ256GB210 low-power 16-bit MCU with USB On-The-Go support, bundling structure, C&DH module, development tools, RTOS/software and documentation.
Typed specifications31 values
Discloses 2 of 7 fields engineers filter by in this category (category median 3).
- Mass
- 300 g total mass: complete Rev D skeletonized 1U chassis, Rev C FM4… · datasheet p.1
- Envelope (L×W×H)
- 10x10x10cm standard 1U · datasheet p.2
- Data interface
- USB bus-powered USB interface for on-the-launcher monitoring, fir… · datasheet p.2 I2C each processor family provides min. 1xI2C | SPI each processor family provides min. 2xSPI | UART each processor family provides min. 2xUART | JTAG JTAG/debug interfaces
- Operating temperature
- -40–85 °C all flight components rated · datasheet p.2
- Form factor
- 0.5U available configuration · datasheet p.2 custom custom configurations | 1U standard 1U (10x10x10cm) | 1.5U available configuration | 2U available configuration +1
- Subsystems included
- OBC C&DH, RTC, mass storage (Motherboard + Pluggable Processor Mo… · datasheet p.1 flight software included Salvo Pro RTOS, EFFS-THIN SD card software and CubeS… | other structure; RBF and launch switches; development/debug systems…
- Payload board format
- CubeSat Kit bus 104-pin stackable CubeSat Kit Bus · datasheet p.2 PC/104 accepts PC/104-sized user modules; COTS +5V PC/104 modules on…
- Free board slots
- 5 max · up to 5 PC/104-sized user modules · datasheet p.2
- Payload mounting
- payload as user modules and/or PC/104 modules on standardized stacking connectors (wiring-free) datasheet p.1
- Structure material
- other aluminium alloy aluminum construction, alloy not stated · datasheet p.2
- Material (as printed)
- aluminum construction, fully alodyned, wear surfaces hard-anodized, all-stainless fasteners datasheet p.2
- Connector
- 104-pin stackable CubeSat Kit Bus connector datasheet p.2
- Flight heritage
- described as "space-proven off-the-shelf professionally engineered CubeSat kit" datasheet p.1
- Satellite class
- CubeSat CubeSat kit · datasheet p.1
- Form factor, U (number)
- 0.5 U 0.5U · datasheet p.2 1.5 U 1.5U | 2 U 2U | 3 U 3U | 1 U standard 1U
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier10 lines, in the manufacturer's own wording
- Mcu
- Microchip PIC24FJ256GB210, low-power 16-bit, with USB OTG
- Processor module
- Pluggable Socketed Processor Module E (PSPM E) with PIC24FJ256GB210
- Processor module variant
- Pluggable Processor Module E1 (PPM E1)
- Programming adapter
- JFPC-PIC24 Programming Adapter
- Debugger
- Microchip MPLAB-ICD3 USB In-Circuit Debugger
- Rtos
- Salvo Pro for PIC24 MCUs and dsPIC DSCs
- File system library
- HCC-Embedded PIC24 EFFS-THIN SD Card Library
- Power supplies included
- External universal +5Vdc 4 A switching supply; external universal 6-12Vdc switching supply
- Structure options
- Different structure sizes; solid-wall or skeletonized construction
- Classification
- Development Hardware | Prototyping Hardware | Development Software | Flight Hardware | Flight Qualified | Space Proven
About
This CubeSat Kit includes hardware solutions (structure, C&DH module with mass storage capability, RBF and Separation switches), software tools (RTOS, library, flash file system), development tools (programmer/debugger) and documentation. The electronics and software are based on the Microchip PIC24FJ256GB210 low-power 16-bit MCU (which adds USB On-The-Go capability versus the standard PIC24 kit). Customers can choose between different structure sizes, and solid-wall or skeletonized construction. It is designated Development Hardware, Prototyping Hardware, Development Software, Flight Hardware, Flight Qualified, and Space Proven.
The kit’s processor-independent components include a complete CubeSat mechanical structure/chassis (Base Plate Assembly, Chassis Wall Assembly in different lengths, Cover Plate Assembly, in either skeletonized or solid-wall versions), a CubeSat Kit Development Board (DB) for in-lab development/debugging/testing, a CubeSat Kit Motherboard Module (MBM) for use inside the structure, a Protoboard Module Kit for through-hole prototyping, a Remove-Before-Flight pin and lanyard, external +5Vdc 4A and 6-12Vdc universal switching power supplies, a USB cable, an Allen wrench, an offset wrench, a Phillips screwdriver, and miscellaneous fasteners/mounting hardware.
Processor-specific components for the PIC24FJ256GB210 MCU include a Pluggable Socketed Processor Module E (PSPM E) with the PIC24FJ256GB210, a Pluggable Processor Module E1 (PPM E1), a JFPC-PIC24 Programming Adapter, a Microchip MPLAB-ICD3 USB In-Circuit Debugger, Salvo Pro for PIC24 MCUs and dsPIC DSCs, PIC24 CubeSat Kit Software, and the HCC-Embedded PIC24 EFFS-THIN SD Card Library for the CubeSat Kit.
The kit is compatible with free Microchip software packages (MPLAB X IDE, XC16 C compiler) for particular supported releases. Every CubeSat Kit is compatible with a wide range of structural and electrical components including the GPS Receiver Module (GPSRM 1), Linear EPS Module, Breakout Board Module, I/O LED Module, Large Aperture Cover Plate Assembly, Solar Panel Clips Set, and Solar Panels. Includes a California Prop 65 warning regarding lead content.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.