Emtech Space Satellite Components
Emtech Space- ProductsSatellite electronic components and subsystems
- CountryGreece
Greek space technology company developing satellite electronic components and subsystems for the European small satellite market.
234 flight-proven satellite platforms, components and ground equipment from verified manufacturers worldwide.
Greek space technology company developing satellite electronic components and subsystems for the European small satellite market.
Indian electronics manufacturer producing space-qualified printed circuit boards, power modules, and avionics for satellite and defense applications.
US manufacturer of space-qualified crystal oscillators and frequency control products for satellite timing and communication systems.
Indian electronics design and manufacturing services (EDMS) company producing satellite subsystems, avionics, and space-grade electronic components.
Chinese space-grade electronics and semiconductor products from Shaanxi Huada, supplying the Chinese aerospace and satellite manufacturing sector.
Fully software-defined universal baseband modulator IC supporting multiple waveforms.
Compact next-generation universal mobile DTV receiver IC.
Compact next-gen universal DTV demodulator SoC for live TV reception on smart TVs, set-top boxes and home gateways.
Fully software-defined universal baseband demodulator IC for worldwide terrestrial, cable, radio and TV broadcast standards.
Custom printed circuit solutions from simple switches to complex multi-pass prints with integrated printed components.
Advanced electronic material solutions including flexible flat cable and fuel cell materials for compact, reliable designs.
K/Ka-band satellite transceiver uplink module with up to 2.5 GHz instantaneous bandwidth for LEO satellite ground stations.
Composite struts combining carbon-fiber tubes with metallic end fittings (aluminum, titanium or invar).
Fully integrated carbon-fiber struts with up to 80% weight savings and near-zero thermal expansion.
Machine-learning platform that predicts a chip design's susceptibility to cosmic-ray-induced failures before fabrication.
Radiation-tolerant, energy-efficient AI edge processor for small satellites and other harsh-environment edge devices.
Heterojunction solar cells manufactured with physical vapor deposition to cut emissions and eliminate hazardous chemicals.
Copper-alloy hyperboloid (springtac) socket contacts with gold or silver plating for military circular connectors.
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