Microelectronics & Components — Space Hardware Marketplace

FLEX CIRCUITS

• Circuit substandard panel size10.5 x 22" max/12 x 24" (267 x 559 mm max./305 x 610 mm), 16.5 x 22" max/18 x 24" (419 x 559 mm max./457 x 610 mm)
• Layers18 for selected designs
• Conductor width/space0.002" (0.05 mm) minimum / 0.002" (0.05 mm) minimum for thinnest foils

Minco Products offers innovative and precision-engineered flexible printed circuit board (Flex PCB) solutions, designed to reduce weight and…

SINGLE- AND DOUBLE-LAYER FLEX

Minco's single and double-layer flex circuits are designed to reduce weight and cost while improving performance in demanding…

HIGH DENSITY INTERCONNECT

• Microvia formation50 micron
• Registration accuracy±12 micron
• Thru-hole plating aspect ratio12:1

Minco High Density Interconnect (HDI) flex circuits improve electrical performance and consistency by using vias as small as…

Circuit Assemblies

Minco engineers provide expertise in assembly, testing, and quality assurance for flexible circuit solutions, ensuring high accuracy and…

RIGID FLEX PCB

Minco's rigid flex circuits combine flexible and rigid board technologies to create compact, robust circuit solutions for demanding…

Multi-layer Flex

Minco's multi-layer flex technology allows stacking layers in applications where wire bundles would otherwise consume excessive space.

Miniature Flex-coils

• Maximum outside dimension (Round)4.50" (114 mm)
• Maximum outside dimension (Rectangular, L)4.50" (114) max
• Maximum outside dimension (Rectangular, W)5.0" (127 mm)

Minco flex-coils combine the advantages of antenna coils and flexible circuits in one compact package, offering a lightweight…

ADM-XRC-9R1

The ADM-XRC-9R1 is a high-performance System On Module (SOM) based on the AMD Zynq Ultrascale+ RFSoC, combining FPGA…

ADM-VB630 Adaptive SoC Development for Space

• Operating temperature-55 to +105 °C
• Storage temperature-60 to +150 °C
• Vibration5 Hz to 100 Hz, PSD increasing at 3 dB/octave 100 Hz to 1000 Hz, PSD = 0.1 g2/Hz 1000 Hz to 2000 Hz, PSD decreasing at 6

A 3U Space VPX reference platform featuring the AMD Versal AI Edge XQRVE2302 Adaptive SoC for Space applications,…

E698PM Radiation-hardened SPARC V8 Quadcore Processor System-on-Chip (SoC)

The E698PM Radiation hardened processor is a high performance, high reliability, high integration and low power multi-core SoC,…

HISAOR Rad-tolerant AI SOC

HISAOR is a rad-tolerant high performance (12 TOPS, 64 GFLOPS) AI SOC designed for high-reliability embedded AI applications.

SiP – System-in-Package

System-in-package (SiP) components integrate multiple integrated circuits into a single module, offering high performance and reliability for harsh…

hisaor AI chip

O.C.E. Technology's hisaor AI chip is designed for embedded vision applications, featuring multiple GPUs, neural network accelerators, and…

OCE TID-ADC

The OCE TID-ADC is a Total Irradiation Dose (TID) monitoring module with a high frequency analogue-to-digital converter supporting…

Diamond-Cooled SERVERS

• GPU temperature reduction10°C
• Token throughput improvement15%
• Additional FLOPs/watt22%

Akash's Diamond Cooled Servers drastically reduce GPU temperatures with Diamond Cooling® technology, providing thermal headroom for performance optimization.

Chip on Diamond

• Temperature Reduction (GPU-on-Diamond)~60%
• Compute Increase2-4x more
• Energy Reduction~40%

Akash Systems' Chips-on-Diamond integrates the extreme thermal conductivity of diamond with essential computing components like GPUs, CPUs, and…

J14H series

• StandardQ/HD20037-2007

The J14H series is a rectangle electrical connector conforming to Chinese military connector standard Q/HD20037-2007, designed with solder…

J14F series rectangle electrical connector

• StandardQ/HD20037-2007

The J14F series is a rectangle electrical connector conforming to Chinese military connector standard Q/HD20037-2007, designed with crimp…