TERABIX
Mbryonics
TERABIX is a radiation-hardened silicon photonic transceiver designed for high-speed data transmission with low power consumption, operating at data rates up to 112Gb/s PAM4.
Key figurescomparable across the catalogue
- Power
- 3 W
- Data rate
- 10,000 Mbps
Normalised to common units so this product can be compared with others in its category. The supplier's own wording is below.
As published by the supplier
- Format
- 10GBASE Ethernet
- Bitrate / gbps
- 10
- Typical power consumption / w
- 3
- Energy consumption per bit / pj
- 300
- Format (2)
- TeraBIX (56 Gb/s/ channel NRZ)
- Bitrate / gbps (2)
- 224
- Typical power consumption / w (2)
- 0.735
- Energy consumption per bit / pj (2)
- 3.3
- Power saving per tb connection / w
- 296.7
- Format (3)
- TeraBIX (112 Gb/s/ channel PAM-4)
- Bitrate / gbps (3)
- 448
- Typical power consumption / w (3)
- 1.916
- Energy consumption per bit / pj (3)
- 4.3
- Power saving per tb connection / w (2)
- 295.7
About
The TeraBIX is a radiation-hardened silicon photonic transceiver engineered for high-speed data transmission while maintaining low power consumption. It supports data rates of up to 56Gb/s NRZ or 112Gb/s PAM4. Key features include radiation-hardened electronics and a hermetically sealed design, making it suitable for demanding space applications. The device boasts ultra-low power operation, consuming less than 5mW/Gb/s. TeraBIX is compatible with SDA Standards 3.1, ensuring interoperability and adherence to industry specifications. For ease of integration and maintenance, it incorporates pluggable fiber connectors. The transceiver also integrates Silicon Photonic Integrated Circuits (ICs) for both the transmitter and receiver, which enhances signal integrity and overall performance. The fiber array attach process further optimizes the connection between optical components, ensuring precise alignment and reliable data transmission. Applications include Optical I/O, offering seamless integration and co-packaging with FPGA/ASIC. It supports direct-to-direct connectivity solutions such as Payload to Payload for efficient data transfer in satellite and aerospace systems, Chip to Chip for advanced computing architectures, and Board to Board for high-speed interconnects in complex systems like data centers and telecommunications infrastructure.
Documentation
No public datasheet yet — request the datasheet / ICD from the supplier.