Xiphos Q9 Versal Computer-on-Module
Xiphos Technologies
High-performance AI/ML-capable Versal-based COTS computer-on-module in a tiny form factor, built for intensive onboard processing.
Typed specifications73 values
Discloses 9 of 13 fields engineers filter by in this category (category median 5).
- Processor
- AMD Versal AI Core Adaptive System-on-Chip datasheet p.3 Dual core ARM Cortex A72 Application Processing Unit | Dual core ARM Cortex R5F Real-Time Processing Unit
- Mass
- 154 g without connectors · datasheet p.3
- CPU clock
- 750 MHz Real-Time Processing Unit · datasheet p.3 1 700 MHz max · Application Processing Unit | 1 700 MHz max · ARM Cortex A72 APU, up to | 750 MHz max · ARM Cortex R5F RPU, up to
- Envelope (L×W×H)
- 90 mm x 110 mm x 20 mm datasheet p.3
- RAM
- 16 384 MB LPDDR4 DRAM · datasheet p.3 16 384 MB LPDDR4 DRAM, PS and PL-accessible (2x8 GB)
- Mass storage
- 1 000 GB 2x SSD, 1,000 GB each, on independent buses (2TB total) · datasheet p.3 0.001 GB MRAM | 1 GB QSPI Flash (NOR) | 1 000 GB SSD (each)
- Operating system
- Yocto Linux BSP (LTS distribution) datasheet p.3 Linux Yocto Linux BSP (LTS distribution)
- Supply voltage
- 8 V min · datasheet p.3 14 V max | 8–14 V
- Power consumption
- 30 W typical · datasheet p.3 30–50 W typical | 30–50 W nom. · 30-50 W, typical | 50 W typical
- Data interface
- LVDS datasheet p.3 Ethernet 10 GbE via GTYP transceivers; 2 multi-rate MACs (1 x 100G or … | GPIO 20 GPIO 1.8 V, 40 GPIO 3.3 V, 49 MIO, 64 LVDS/single ended GPIO | LVDS 64 LVDS/single ended GPIO; mezzanine connectors | CAN CAN via MIO +11
- Operating temperature
- -40–60 °C datasheet p.3
- Processor architecture
- ARM Cortex-A dual core ARM Cortex A72 Application Processing Unit · datasheet p.3 ARM Cortex-R dual core ARM Cortex R5F Real-Time Processing Unit
- Radiation and fault mitigation
- EDAC / ECC on RAM EDAC-protected RAM (Q9S flight models) · datasheet p.3 FPGA bitstream scrubbing FPGA bit-stream scrubbing | latch-up protection (current limiting) over-current protection (multiple); over-current detection & … | software watchdog software robustness / watchdog | TMR in FPGA triple mode redundancy in Control FPGA (Q9S flight models) +6
- Connector
- 2 mezzanine connectors datasheet p.3
- Flight heritage
- cumulative time on orbit stands at more than 568 years (As of July 2025), no on-orbit product failures, more than 260 boards in space datasheet p.4
- Missions flown
- 260 datasheet p.4 260 min · more than 260 boards in space as of July 2025 (Xiphos products)
- Cores
- 2 ARM Cortex A72 Application Processing Unit · datasheet p.3 2 ARM Cortex R5F Real-Time Processing Unit
- FPGA
- AMD Versal AI Core Adaptive SoC: 820,000 system logic cells, 750,000 flip flops, 375,000 look-up tables, 984 DSP slices; Control FPGA Microchip PolarFire datasheet p.3
- GPIO lines
- 64 datasheet p.2 20 GPIO 1.8 V | 40 GPIO 3.3 V | 20 | 40
- AI performance
- 101 TOPS 152 AI Engine-ML tiles, 101 TOPS and 8 TFLOPs · datasheet p.3
- RAM type
- LPDDR4 datasheet p.3 MRAM 1MB MRAM for critical telemetry/state data
- Program / boot memory
- 1 MB MRAM for critical telemetry/state data · datasheet p.3 1 MB QSPI Flash (NOR), 4x 256 MB
- Data interface speed
- 26 562.5 Mbps GTY transceivers supporting PCIe Gen 4, Ethernet, JESD204b, S… · datasheet p.3
- Analog inputs
- 4 datasheet p.2
Each value is typed with its unit and measurement condition and cites the datasheet page it was taken from. Nothing is guessed: a field that is absent here has not been published by the manufacturer. machine-extracted ✓ checked by NewSpace Market ✓ manufacturer confirmed by the manufacturer.
As published by the supplier17 lines, in the manufacturer's own wording
- Operating temperature
- -40 to +60 °C
- Dimensions
- 90 mm x 110 mm x 20 mm
- Mass
- 56 g without connectors
- Power
- 30-50 W typical; 8 to 14 VDC; over-current detection & protection (global and local) and brownout protection
- Memory
- 16 GB LPDDR4 DRAM (2x8 GB); 1 GB (4x 256 MB) QSPI Flash (NOR); 2x NVMe SSD, 1,000 GB each, on independent buses/firecode power control; 2x LPDDR4 interfaces PS and PL-accessible, 8 GB each; 1 MB MRAM for critical telemetry/state data
- Mpsoc model
- AMD Versal System-on-Chip
- Application processing unit
- Dual core ARM Cortex A72 Application Processing Unit at up to 1.7 GHz
- Real-time processing unit
- Dual core ARM Cortex R5F Real-Time Processing Unit at up to 750 MHz
- Ai engines
- 152 AI Engine-ML Tiles
- System logic cells
- 820,000
- Flip flops
- 750,000 FF
- Look-up tables
- 375,000 LUT
- Dsp slices
- 984
- Control FPGA
- Microchip PolarFire
- Operating system
- Yocto Linux BSP (LTS distribution)
- Real time clock
- RTC with sleep & wake up on alarm/interrupt; dedicated power pin for external battery
- Interfaces
- 2 mezzanine connectors providing 1.8V/3.3V GPIO, 1.8 V MIO, LVDS; 26.5625 Gbps GTY transceivers supporting PCIe Gen 4, Ethernet, JESD204b, SSD, SERDES, etc.; 2 multi-rate MACs (each 1x100G or 2x50G/40G or 4x10G)
About
The Q9 is the first time a Versal-based platform has been available in such a small form-factor that can fit almost anywhere. It is also a true commercial grade platform with all of the benefits of COTS but with the tools and systems in place to make development, demonstration and launch fast and reliable. It is ideal for development of the next generation of intensive AI applications. The card extends the capability of the Xiphos Q-Card processor family, adding support for high-speed JESD204B interfaces and PCIe, as well as access to 2TB of high speed data storage. The Q9 is ideal for advanced payload applications, requiring onboard AI/ML processing, I/O-intensive applications, and high-speed C&DH systems. At its core is a hybrid environment of powerful multi-core CPUs and reprogrammable logic, providing flexible and scalable performance, primarily aimed at missions that need intensive processing capabilities such as real-time sensor processing using AI/ML and can afford the power budget of 30-50 W.
Documentation
Need the full ICD, test reports or a specific revision? Ask the supplier directly.