Xiphos Technologies

Updated 22 Jul 2026

Manufacturer Canada Listed

17 Products

5 Services

23 Years Active

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About Xiphos Technologies

Xiphos Technologies is a Montreal, Quebec-based space electronics company specialising in flight-proven, low-SWaP (Size, Weight, and Power) processing modules for small satellites and commercial space missions. The company's core product philosophy centers on enabling ambitious satellite missions with compact, power-efficient computing hardware that incorporates two decades of fault-tolerant space architecture development.

The Xiphos Q-Card family spans the full range of modern processing demands: from the dual-core ARM Cortex-A9 Q7 for embedded control tasks, through the Zynq UltraScale+ Q8 and Q8J modules for high-performance imaging and communications payloads, to the ZU28DR/ZU48DR RFSoC-based Q8RF and Q8RFG3 for direct RF sampling applications. The newly introduced Q9 harnesses AMD's Versal AI-edge SoC with 152 AI Engine-ML tiles for on-orbit machine learning inference. All products share a radiation effects mitigation suite derived from HARDSIL principles, with TID ratings up to 30 krad(Si).

The company also offers a complete Q8 On-Board Computer (OBC) system for operators who need a ready-to-integrate spacecraft computer, delivering over 120 years of cumulative flight heritage across SmallSat constellations and missions for commercial and government customers. Expansion modules including the Q7 ACS Daughterboard, Q8 Optical Payload Processor, and Q8J SDR Dock allow the core processing modules to interface with attitude control sensors, camera systems, and software-defined radio payloads respectively.

Xiphos serves the growing commercial constellation market, defense agencies, and scientific research organisations, and is a recognized partner in the AMD space-grade ecosystem. The company provides Linux SDKs, Vivado skeleton projects, and application notes to accelerate customer software development.

Milestones

2003 Xiphos Technologies founded in Montreal
2011 First Q6 processor board achieves spaceflight
2019 Q8 Computer-on-Module introduced on Zynq UltraScale+
2023 Q8RF RFSoC processor introduced for direct RF sampling applications
2024 Q8RFG3 Gen 3 and Q8J SDR daughterboard launched
2026 Q9 Versal AI-edge module introduced for satellite AI/ML payloads

Company Info

Headquarters Montreal, Quebec, Canada, Canada

Founded 2003 (23 years)

Specializations

manufacturer

Website xiphos.com ↗

LinkedIn linkedin.com/company/xiphos-technologies ↗

Email sales@xiphos.com

Products

Attitude Control System expansion board for the Q7 processor, providing ACS interfaces, H-bridge drivers, and power switching.

1 7

Serial interfaces	Multiple RS-422 / RS-485
Actuator drivers	3x full H-bridge drivers
Switchable output voltages	5 V, 15 V, 28 V
Monitoring	Current and voltage monitoring & telemetry
Dimensions	100 x 76 x 14.5 mm (with Q7, excluding RJ45)
Supply voltage	25 to 34 V (28 V nominal)
Power consumption (Idle)	2.7 W

Flight-proven

Ultra-low SWaP Zynq-based processor card for embedding in custom satellite payloads and bus subsystems.

1 11

Processor	Xilinx Zynq SoC
Cpu	Dual-core ARM Cortex-A9 MPCore
Logic	Programmable FPGA fabric
Ram	LPDDR2 with ECC
Flash	2x QSPI Flash (NOR)
Storage	2x MicroSD
Interfaces	Gigabit Ethernet, USB 2.0, serial, 90 I/O via mezzanine connector
Power (Typical)	2 W
Supply voltage	5 to 28 V
Operating system	Linux SDK
Radiation tolerance (TID)	25 krad (Si)

Flight-proven

The Q7 is a space-qualified processor board featuring a Xilinx Zynq SoC with dual-core Cortex-A9 MPCore processors and reprogrammable logic, designed for high-performance computing in space applications.

1 10

Processor	Xilinx Zynq SoC includes ARM dual-core Cortex-A9 MPCore processors supported by massive programmable logic resources
Memory	LPDDR2 RAM (with ECC)
Memory (2)	2x QSPI Flash (NOR)
Memory (3)	2x MicroSD
Power	Typical 2 W
Supply voltage	5 V to 28 V
Interfaces	Gigabit Ethernet, USB 2.0, serial, 90 I/O including LVDS, accessible through a mezzanine connector
Operating system	Linux Software Development Kit (SDK)
Space hardening	Radiation effects mitigation suite
Space hardening (2)	Tested to 25krad TID

Flight-proven

Low SWaP Zynq UltraScale+ MPSoC processor with 30 krad radiation tolerance for demanding satellite payloads and bus subsystems.

1 14

Mpsoc	Xilinx Zynq UltraScale+
Application cpu	Quad-core ARM Cortex-A53
Real-time cpu	Dual-core ARM Cortex-R5
Gpu	ARM Mali-400
Ram	4 GB LPDDR4 (ECC)
Flash	2x 256 MB QSPI (NOR)
Storage	2x 128 GB eMMC
Ethernet	4x Gigabit Ethernet MAC
USB	2x USB 3.0/2.0
CAN	2x CAN 2.0B
Power (Typical)	5 W
Supply voltage	9 to 15 V
Operating system	Linux SDK
Radiation tolerance (TID)	30 krad (Si)

Flight-proven

The Q8 is a spaceflight-ready miniature processing board, building on the Xiphos Q-card family's heritage, offering high performance and flexibility for demanding space applications.

3 14

Processor	Xilinx Zynq UltraScale+ Multi-Processor System-on-Chip (MPSoC) Processing FPGA
Cpu	quad-core ARM Cortex-A53 Application Processing Unit
Real-time processing unit	dual-core ARM Cortex-R5
Gpu	ARM Mali-400
Ram	4 GB LPDDR4 (with ECC)
Qspi flash (NOR)	2 x 256 MB
Emmc	2 x 128 GB
Power input	9 V to 15 V
Interfaces	Gigabit Ethernet, USB 2.0 & 3.1, serial, multiple high speed I/O via mezzanine connector (GPIO, LVDS, GTR multi-Gbps transceivers for SATA or PCI Express (PCIe Gen 2))
Software	Linux SDK
Radiation effects mitigation	Yes
TID lifetime	30krad
Flight heritage	Extensive heritage of flight-proven Q-card family
Mpsoc peripherals (Q8 and Q8J)	4x Gigabit Ethernet MAC, 2x USB 3.0/2.0, 2x CAN 2.0B, 2x SDIO, 2x SPI, 2x UART, 2x I2C, GPIO, PCI Express (PCIe) Gen 2, SATA 6Gbs Rev 3.1

Flight-proven

Flight-proven SmallSat on-board computer based on the Q8 processor, providing full spacecraft control with 120+ years of flight heritage.

1 12

Processor	Xilinx Zynq SoC (ARM dual-core Cortex-A9 MPCore)
Control FPGA	Microchip ProASIC3
Ram	256 MB LPDDR2 (ECC)
Storage	2x MicroSD
Serial interfaces	RS-422, RS-485, RS-232, CAN, LVDS-based protocols
Ethernet	Gigabit Ethernet
USB	USB 2.0
Dimensions	167.3 x 182.6 x 91 mm
Mass	957 g
Power (Nominal)	7.5 W
Power (Peak)	14 W
Operating temperature	-40 to +60 deg C

High-performance image processing daughterboard for the Q8, featuring dual Camera Link interfaces for space-based Earth observation.

1 8

Camera interfaces	1x Base Camera Link, 1x Medium Camera Link (configurable as LVDS)
Serial interfaces	RS-485 / RS-422
Network	Gigabit Ethernet
Timing	PPS input and output
Ancillary functions	Heater power control, temperature sensing
Dimensions	150 x 110 x 10 mm (without Q8)
Supply voltage	9 to 13 V
Radiation tolerance (TID)	30 krad (Si)

1 7

RF transceiver	Analog Devices AD9361
RF outputs	2x
RF inputs	2x
Other interfaces	CAN Bus, USB 2.0, PPS input, LVDS GPIO (SpaceWire capable)
Dimensions	80 x 80 x 34.7 mm (with Q8 installed)
Supply voltage	5 V and 12 V
Power (Typical)	7.3 W (two RF transmitters active)

Flight-proven

Low SWaP Zynq UltraScale+ processor with GTH multi-Gbps transceivers and JESD204B support for next-generation SDR and high-speed payload applications.

1 11

Mpsoc	Xilinx Zynq UltraScale+
Application cpu	Quad-core ARM Cortex-A53
Real-time cpu	Dual-core ARM Cortex-R5
Ram	4 GB LPDDR4 (ECC)
Flash	2x 256 MB QSPI (NOR)
Storage	2x 128 GB eMMC
High-speed transceivers	GTH/GTR multi-Gbps (SATA, PCIe Gen 2, JESD204B)
Power (Typical)	6 W
Supply voltage	5 to 9 V
Operating system	Linux SDK
Radiation tolerance (TID)	30 krad (Si)

High-capacity payload data storage and interface computer for the Q8J, providing 2 TB SSD storage and extensive high-speed I/O.

1 13

Storage	2x 1 TB SSD
Sustained write speed	>300 MB/s
Ethernet	4x GigE (1 Gbps) with magnetics
CAN	2x CAN controllers
RS-422	7x RS-422 ports
RS-485	1x RS-485 port
LVDS outputs	16x
LVDS inputs	12x
Dimensions	90 x 190 x 25 mm
Mass (with Q8J + hardware)	260 g
Supply voltage	11.4 to 12.6 V (12 V nominal)
Power (Typical)	12 W (all interfaces active, 1 SSD)
Operating temperature	-40 to +60 deg C

Flight-proven

The Q8J is a low SWaP processor board designed for space applications, featuring a Xilinx Zynq UltraScale+ MPSoC and multi-Gigabit transceivers for high-speed interfaces.

2 14

Processor	Xilinx Zynq UltraScale+ Multi-Processor System-on-Chip (MPSoC) Processing FPGA
Application processing unit	quad-core ARM Cortex-A53
Real-time processing unit	dual-core ARM Cortex-R5
Gpu	ARM Mali-400
Ram	4 GB LPDDR4 (with ECC)
Qspi flash (NOR)	2 x 256 MB
Emmc	2 x 128 GB
External memory support	PL-accessible DDR3 or DDR4 via mezzanine connector
Typical power	6 W @ 5 V to 9 V
Interfaces	Gigabit Ethernet, USB 2.0 & 3.1, serial, multiple high-speed I/O via mezzanine connector (GPIO, LVDS, GTH and GTR multi-Gbps transceivers for SATA, PCIe, JESD204B)
Sdk	Linux SDK
Radiation effects mitigation	Yes
TID lifetime	30krad
Flight heritage	Numerous LEO applications, launchers, and on the moon

1 9

RF transceiver	Analog Devices AD9361 RF agile transceiver
RF outputs	2x
RF inputs	2x
Pl memory	1 GB DDR3
Flash	4 GB NAND Flash
Interfaces	Gigabit Ethernet, CAN Bus, SPI, GPS input, PPS input, LVDS GPIO
Dimensions	80 x 106 x 23.5 mm (with Q8J)
Supply voltage	6 to 8.4 V
Power (Typical)	7 W (two RF transmitters active)

3 21

Mpsoc	Xilinx Zynq UltraScale+ ZU28DR
Application cpu	Quad-core ARM Cortex-A53 @ up to 1.2 GHz
Real-time cpu	Dual-core ARM Cortex-R5 @ 500 MHz
Ps ram	4 GB LPDDR4 DRAM (EDAC)
Pl ram	4 GB DDR4 DRAM
ADC channels	8
ADC sample rate (max)	4.096 GSPS
ADC resolution	12 bit
DAC channels	8
DAC sample rate (max)	6.5554 GSPS
DAC resolution	14 bit
RF input frequency (max)	4 GHz
System logic cells	930,000
Dsp slices	4,272
Gty transceivers	16 x 28.21 Gbps
Dimensions	100 x 100 x 20 mm
Mass	200 g
Power (Typical)	20 to 30 W
Supply voltage	5 to 9 V
Operating temperature	-40 to +60 deg C
Radiation tolerance (TID)	30 krad (Si)

Third-generation space-grade RFSoC processor with 8-channel 14-bit ADC/DAC up to 6 GHz RF input and multi-device synchronization for phased-array applications.

2 19

Mpsoc	Xilinx Zynq UltraScale+ ZU48DR
Application cpu	Quad-core ARM Cortex-A53 @ up to 1.2 GHz
Real-time cpu	Dual-core ARM Cortex-R5 @ 500 MHz
Ps ram	4 GB LPDDR4 DRAM (EDAC)
Pl ram	4 GB DDR4 DRAM
Storage	2x 128 GB eMMC
ADC channels	8
ADC sample rate (max)	5.0 GSPS
ADC resolution	14 bit
DAC channels	8
DAC sample rate (max)	9.85 GSPS
DAC resolution	14 bit
RF input frequency (max)	6 GHz
Multi-device synchronization	Supported (phased-array/digital beamforming)
Dimensions	100 x 100 x 20 mm
Mass	200 g
Power (Typical)	25 to 35 W
Supply voltage	5 to 15 V
Operating temperature	-40 to +60 deg C

Flight-proven

High-performance AMD Versal AI-edge compute module with 152 AI Engine tiles, 2 TB NVMe storage, and 30-50 W power budget for satellite AI/ML payloads.

1 19

Mpsoc	AMD Versal SoC
Application cpu	Dual-core ARM Cortex-A72 @ 1.7 GHz
Real-time cpu	Dual-core ARM Cortex-R5F @ 750 MHz
Ai engines	152 AI Engine-ML tiles
System logic cells	820,000
Dsp slices	984
Ps lpddr4 ram	8 GB
Pl lpddr4 ram	8 GB
Qspi flash (NOR)	1 GB
Nvme SSD	2x 1,000 GB (independent buses)
Mram	1 MB
Gty transceivers	26.5625 Gbps (PCIe Gen 4, Ethernet, JESD204B)
Control FPGA	Microchip PolarFire
Dimensions	90 x 110 x 20 mm
Mass	56 g (without connectors)
Power (Typical)	30 to 50 W
Supply voltage	8 to 14 V DC
Operating temperature	-40 to +60 deg C
Operating system	Yocto Linux BSP (LTS)

Zynq UltraScale+ RFSoC-based space processor family (Q8RF Gen 1 and Q8RFG3 Gen 3) combining direct RF sampling, FPGA logic, and ARM processing for onboard SDR.

5 26

Operating temperature	-40 to +60 °C
Dimensions	100 mm x 100 mm x 20 mm
Mass	200 g
Power (Q8RF)	20-30 W typical @ 5-9 V
Power (Q8RFG3)	25-35 W typical @ 5-15 V
Memory	4 GB PS LPDDR4 DRAM (with EDAC); 4 GB PL DDR4 DRAM; 2x 256 MB QSPI Flash (NOR)
Storage	2x 32 GB NAND Flash; 2x 128 GB eMMC
Mpsoc (Q8RF)	ZU28DR
Mpsoc (Q8RFG3)	ZU48DR
Application processing unit	Quad-core ARM Cortex A53 Application Processing Unit at up to 1.2 GHz
Real-time processing unit	Dual-core ARM Cortex-R5 @ 500 MHz
ADCS (Q8RF)	8, each 4.096 GSPS max; 12-bit
ADCS (Q8RFG3)	8, each 5.0 GSPS max; 14-bit
RF input frequency, max (Q8RF)	4 GHz
RF input frequency, max (Q8RFG3)	6 GHz
Dacs (Q8RF)	8, each 6.5554 GSPS max; 14-bit
Dacs (Q8RFG3)	8, each 9.85 GSPS max; 14-bit
Decimation/interpolation (Q8RF)	1x, 2x, 4x, 8x
Decimation/interpolation (Q8RFG3)	1x, 2x, 3x, 4x, 5x, 6x, 8x, 10x, 12x, 16x, 20x, 24x, 40x
System logic cells	930,000
Clb flip flops	850,000
Clb luts	425,000
Dsp slices	4,272
Control FPGA	Microchip ProASIC3
Operating system	Yocto Linux BSP (LTS distribution)
Bottom RF mezzanine connector	8x Transmit + 8x Receive RF; Ext Ref Clock(s) In, Ref Clock Out

Flight-proven

High-performance AI/ML-capable Versal-based COTS computer-on-module in a tiny form factor, built for intensive onboard processing.

1 17

Operating temperature	-40 to +60 °C
Dimensions	90 mm x 110 mm x 20 mm
Mass	56 g without connectors
Power	30-50 W typical; 8 to 14 VDC; over-current detection & protection (global and local) and brownout protection
Memory	16 GB LPDDR4 DRAM (2x8 GB); 1 GB (4x 256 MB) QSPI Flash (NOR); 2x NVMe SSD, 1,000 GB each, on independent buses/firecode power control; 2x LPDDR4 interfaces PS and PL-accessible, 8 GB each; 1 MB MRAM for critical telemetry/state data
Mpsoc model	AMD Versal System-on-Chip
Application processing unit	Dual core ARM Cortex A72 Application Processing Unit at up to 1.7 GHz
Real-time processing unit	Dual core ARM Cortex R5F Real-Time Processing Unit at up to 750 MHz
Ai engines	152 AI Engine-ML Tiles
System logic cells	820,000
Flip flops	750,000 FF
Look-up tables	375,000 LUT
Dsp slices	984
Control FPGA	Microchip PolarFire
Operating system	Yocto Linux BSP (LTS distribution)
Real time clock	RTC with sleep & wake up on alarm/interrupt; dedicated power pin for external battery
Interfaces	2 mezzanine connectors providing 1.8V/3.3V GPIO, 1.8 V MIO, LVDS; 26.5625 Gbps GTY transceivers supporting PCIe Gen 4, Ethernet, JESD204b, SSD, SERDES, etc.; 2 multi-rate MACs (each 1x100G or 2x50G/40G or 4x10G)

Additional Services

Testing & qualification

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Xiphos conducts environmental qualification testing for their products. This includes Thermal Vacuum (TVAC) testing, vibration testing, and shock testing. These tests are part of a comprehensive qualification process to ensure the reliability and resilience of their hardware in harsh space…

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Xiphos performs a radiation qualification test campaign to quantify radiation exposure. This includes board-level proton testing and Total Ionizing Dose (TID) testing using gamma rays. They measure both TID, which accumulates over time, and Single-Event Effects (SEE), which are individual…

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Engineering & analysis

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Xiphos provides technical support to assist customers with product understanding and overcoming initial learning curves. They also offer project-specific support packages, which can be utilized for developing custom software or logic, reviewing customer designs, or aiding in the design of…

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Other services

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Xiphos provides comprehensive custom development services, encompassing hardware, firmware, and software. Their adept team crafts bespoke hardware solutions from concept to production, leveraging their heritage in space applications. Firmware engineers develop embedded logic solutions for control, communications, and processing, offering…

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Xiphos Technologies

About Xiphos Technologies

Milestones

Products

Q7 ACS Daughterboard

Q7 ACS Daughterboard

Description

Specifications

Q7 Computer-on-Module

Q7 Computer-on-Module

Description

Specifications

Q7 Processor

Q7 Processor

Description

Specifications

Q8 Computer-on-Module

Q8 Computer-on-Module

Description

Specifications

Q8 Low SWaP Computer-on-Module

Q8 Low SWaP Computer-on-Module

Description

Specifications

Q8 On-Board Computer

Q8 On-Board Computer

Description

Specifications

Q8 Optical Payload Processor

Q8 Optical Payload Processor

Description

Specifications

Q8 SDR Dock Daughterboard

Q8 SDR Dock Daughterboard

Description

Specifications

Q8J Computer-on-Module

Q8J Computer-on-Module

Description

Specifications

Q8J Data Storage and Interface Board

Q8J Data Storage and Interface Board

Description

Specifications

Q8J Low SWaP with GTH Computer-on-Module

Q8J Low SWaP with GTH Computer-on-Module

Description

Specifications

Q8J SDR Daughterboard

Q8J SDR Daughterboard

Description

Specifications

Q8RF Gen 1 RFSoC Processor

Q8RF Gen 1 RFSoC Processor

Description

Specifications

Q8RFG3 Gen 3 RFSoC Processor

Q8RFG3 Gen 3 RFSoC Processor

Description

Specifications

Q9 Versal Computer-on-Module

Q9 Versal Computer-on-Module

Description

Specifications

Xiphos Q8RF Family

Xiphos Q8RF Family

Description

Specifications

Xiphos Q9 Versal Computer-on-Module

Xiphos Q9 Versal Computer-on-Module

Description

Specifications

Additional Services

Reviews